文章來源 : 廣東優(yōu)科檢測 發(fā)表時(shí)間：2024-06-04 瀏覽數(shù)量：
AEC-Q200 是汽車電子委員會(huì) (Automotive Electronics Council, AEC) 制定的標(biāo)準(zhǔn)，專門用于汽車電子元器件的可靠性測試，包括陶瓷電容器。為了確保陶瓷電容器符合AEC-Q200標(biāo)準(zhǔn)，需要進(jìn)行一系列測試。這些測試旨在驗(yàn)證元器件在各種極端條件下的性能和可靠性。
優(yōu)科檢測是具備AEC-Q200標(biāo)準(zhǔn)CNAS全項(xiàng)檢測能力的第三方陶瓷電容器AEC-Q200認(rèn)證測試機(jī)構(gòu)，接下來為大家介紹陶瓷電容器AEC-Q200認(rèn)證測試項(xiàng)目及樣品數(shù)量要求。
| Table 2: Stress Qualifications for Ceramic Capacitors 陶瓷電容器的應(yīng)力條件 | |||||||||
| NO. 序號(hào) | Stress 測試內(nèi)容 | Reference 測試方法 | Minimum Sample Size Per Lot Depending on Component Size (cm3) | Number of lots 批次 | Accept on Number failed 允許不合格數(shù) | ||||
| 樣品體積 <10cm3 Sample Size Per 測試樣品數(shù)量 | ≧10cm3 ≦330cm3 | >330cm3 | Individual 單個(gè)型號(hào) | Family 系列 | |||||
| 1 | Pre- and Post-Stress Electrical Test 應(yīng)力測試前后電氣測試 | User Specification. 用戶規(guī)范 | 除非另有規(guī)定，所有認(rèn)證器件 All qualification components unless otherwise specified | 0 Fails | |||||
| 2 | Temperature Cycling 溫度循環(huán) | JESD22-A104 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
| 3 | Destructive Physical Analysis 破壞性物理分析 | EIA-469 | 10 | 5 | 3 | 1 | 3 | 0 Fails | |
| 4 | Humidity Bias 高溫高濕 | MIL-STD-202 Method 103 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
| 5 | High Temperature Operating Life 高溫工作壽命 | MIL-STD-202 Method 108 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
| 6 | External Visual 外觀檢查 | MIL-STD-883 Method 2009 | 所有認(rèn)證器件 All qualification parts submitted for testing | 0 Fails | |||||
| 7 | Physical Dimension 尺寸檢查 | JESD22-B100 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
| 8 | Terminal Strength（THT） 端子強(qiáng)度 | MIL-STD-202 Method 211 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
| 9 | Resistance to Solvents 耐溶劑測試 | MIL-STD-202 Method 215 | 5 | 4 | 3 | 1 | 3 | 0 Fails | |
| 10 | Mechanical Shock 機(jī)械沖擊 | MIL-STD-202 Method 213 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
| 11 | Vibration 振動(dòng) | MIL-STD-202 Method 204 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
| 12 | Resistance to Soldering Heat 耐焊接熱 | MIL-STD-202 Method 210 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
| 13 | ESD ESD靜電測試 | AEC-Q200-002 | 15 | 6 | 3 | 1 | 3 | 0 Fails | |
| 14 | Solderability 可焊性 | J-STD-002 | 15 each condition | 6 | 3 | 1 | 3 | 0 Fails | |
| 15 | Electrical Characterization 電氣特性 | User Specification. | 30 | 10 | 4 | 3 | 3 | 0 Fails | |
| 16 | Board Flex (SMD) 板彎曲（貼片） | AEC-Q200-005 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
| 17 | Terminal Strength (SMD) 引出端強(qiáng)度（貼片） | AEC-Q200-006 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
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